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The impact of packaging-induced circuit performance changes for a small-scale integrated circuit (IC) smaller than 1.0 mm 2 has been evaluated by a new method with specially designed test chips. Analog circuits such as power management ICs for portable electronic devices are small-scale chips and require high-accuracy operation. Multiple test chips with different resistor locations have been fabricated...
Stress-induced parametric changes during the resin-molded packaging of a small-scale integrated circuit (IC) smaller than 1.0 mm2 have been evaluated by a specially designed test chip. Multiple test chips with different resistor locations have been fabricated and measured by die-to-die correspondence. One contour plot was reproduced from the measurement results. The present paper shows the distribution...
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