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In this work, the Poly-Harmonic Distortion (PHD) model has been used to characterize the nonlinearities of Bulk Acoustic Wave (BAW) solidly mounted resonators (SMR). The new approach of using X-parameters for characterization and simulation of nonlinearities is described. The amplitude and phase of the fundamental mode and its harmonics up to third order have been measured and simulated by using the...
Wire bonding is the most widely used interconnection technology in microelectronics. Aggressive technology scaling has led to device miniaturization resulting in a need for ultra-fine pitch bonding. A deep understanding of the bond formation process will help improve wire bond process reliability and product yield. This paper reports on the study of ball bond (1st bond on the chip) formation process...
Microelectronic wire bonding is an essential step in today's microchip production. It is used to weld (bond) microwires to metallized pads of integrated circuits using ultrasound with hundreds of thousands of vibration cycles. Thermosonic ball bonding is the most popular variant of the wire bonding process and frequently investigated using finite element (FE) models that simplify the ultrasonic dynamics...
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