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The parallel capacitive temperature micro-sensor is designed and fabricated based on the metal multi-user MEMS processes. The interdigitated capacitors parallelly connected with the plane capacitor are used as the temperature sensing structures. Thermal expansion of the top layer cause the out-of-plane deformation, and introduce horizontal and vertical displacements of the structure, which leads to...
In an LC-type passive wireless sensor system for multi-parameter monitoring, it is desirable for the inductors to be coaxially aligned stacked in order to save area. However, the transmitting signals affect each other due to mutual coupling between the stacked inductors. This paper presents a novel structure of inductor which is in a specific winding to achieve the minimized mutual inductance. Simulation...
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