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This paper presents a test infrastructure development and test scheduling strategy for 3D-SICs under resource (test pins and TSVs) and power constraints. Depending upon the various scheduling restrictions, two test scheduling strategies have been proposed with an objective to minimize the overall test time (TT) of the stack. A step-by-step approach deals with the individual dies separately and develops...
This paper presents a test architecture optimization and test scheduling strategy for TSV based 3D-Stacked ICs (SICs). A test scheduling heuristic, that can fit in both session-based and session-less test environments, has been used to select the test concurrency between the dies of the stack. The proposed method minimizes the overall test time of the stack, without violating the system level resource...
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