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Sporadic voiding within the interfacial Cu3Sn intermetallic compound (IMC) layer-sometimes referred to as ??Kirkendall voiding??-has been found to lead to degradation of solder joint reliability in board level, mechanical shock testing. It has been suggested that the voiding phenomenon is a result of the incorporation of organic impurities in the copper (Cu) deposit during electroplating. In the present...
One reliability concern, when soldering to a Cu surface finish, is the sporadic mechanical degradation of solder joints due to the formation and growth of voids within the interfacial Cu3Sn intermetallic compound (IMC) layer and at its interface with the Cu pad structure. Excess organic impurity incorporation during Cu electroplating has been shown to cause this problem. The level of impurity incorporation...
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