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For wearable applications, a contactless power-transfer solution is one of the required features since exposed metal contacts for battery charge could be easily corroded by moisture and sweat. There are 3 standards for the wireless power transfer (WPT): Qi [1], PMA [2] and A4WP [3]. The Qi and PMA use a similar frequency range from 100kHz to 300kHz. However, the A4WP uses a much higher frequency of...
This paper presents a co-process technology of the through silicon via (TSV) and embedded IC for 3D heterogeneous IC integration. Heterogeneous ICs are embedded by using silicon cavities and advanced TSVs for 3D interconnection are integrated in the interposer at the same time. Organic lamination is used to fill the gap and make an insulation layer. A laser drilling process is used to make via interconnections...
Recently, supply of new energy system such as photovoltaics and information technology equipment are being increased therefore, the importance on Direct Current (DC) protective equipment has also increased. In protective equipment, short-circuit performance is very important. But, due to lack of test facilities, verification of short-circuit performance for protective equipment to be used in DC system...
In this paper, an embedded passive and active package is developed by using silicon substrates. Embedded passives are integrated on the silicon substrate or laminated organic using thin-film processes, and active devices are embedded in the silicon using cavity structures. Organic lamination processes are used for filling the gap between IC and silicon and also, it is possible to realize thick insulation...
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