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The failure mechanisms of Ni/Sn3.0Ag0.5Cu/ENEPIG flip chip solder joint were investigated during EM at 150 °C under a current density of 1×104 A/cm2. In as-soldered state, (Cu,Ni)6Sn5 IMCs formed at the both Ni/solder and electroless Ni-P/solder interfaces, and the spalled (Cu0.58Ni0.42)6Sn5 was observed in the solder at the chip side. After aging for 600 h, the interfacial IMCs at the both Ni/solder...
The Cu/Sn3.0Ag0.5Cu/Ni (Cu/SAC305/Ni) solder joints were designed to investigate the Cu, Ni atoms diffusion behavior and the interfacial reaction during electromigration (EM) at 180 °C under a current density of 1.0×104 A/cm2. For comparison, the Cu/Sn3.0Ag0.5Cu/Ni solder joints were aged at 180 °C for the same durations. In as-soldered state, the (Cu0.55Ni0.45)6Sn5 and (Cu0.92Ni0.08)6Sn5 IMCs formed...
The line-type Cu/Sn/Ni interconnects were used to determine the effect of electromigration (EM) on the Cu-Ni cross-interaction under the current density of 1.0×104 A/cm2 at 150 °C for 100 h and 200 h. For the purpose of comparison, the line-type Cu/Sn/Ni interconnects were also aged at 150 °C for 100 h and 200 h. After soldering, Ni3Sn4 and Cu6Sn5 IMCs formed at the Sn/Ni and Sn/Cu interfaces, respectively...
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