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The application of high thermal conductive Epoxy resin (EP) is an efficient way to improve the heat dissipation in electronic device. In this work, the thermal conductivity of EP is significantly improved by synergistically utilizing Al2O3 framework (AF) and boron nitride sheet (BN) as fillers. The polyurethane foams with different pore sizes are used to prepare AF for the first time. The microstructure...
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