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In this work, the grain orientations and surface characteristics of Cu6Sn5 textures formed at the liquid-Sn0.7Cu|(111)Cu and liquid-Sn0.7Cu|(001)Cu joint interfaces were systematically investigated using the electron backscattered diffraction technique. The results showed that there were two dominant reasons for formation of the strong Cu6Sn5 textures on the (111)Cu and (001)Cu surfaces: (1) the low...
Properties of body-centered tetragonal beta-Sn are highly anisotropic. The crystal orientation of the beta-Sn has a marked effect on the stress state in the SnAgCu solder joints. A finite element analysis has been performed of the thermal cycling of the SnAgCu solder and solder joints. Significant amounts of stresses at the solder/Cu interface and in the plane of the grain boundary was found. The...
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