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Formation mechanism and reliability of the Cu6Sn5 textures formed in-between the liquid SnCu0.7 solder and (111)/(001) Cu single crystals were studied in this paper. Regular arrays of the roof-type Cu6Sn5 grains with the fixed intersecting angles were generated on both types of Cu single crystals after soldering at 250°C for 1 min. The formation mechanism of these Cu6Sn5 roofs was confirmed to be...
In this work, the grain orientations and surface characteristics of Cu6Sn5 textures formed at the liquid-Sn0.7Cu|(111)Cu and liquid-Sn0.7Cu|(001)Cu joint interfaces were systematically investigated using the electron backscattered diffraction technique. The results showed that there were two dominant reasons for formation of the strong Cu6Sn5 textures on the (111)Cu and (001)Cu surfaces: (1) the low...
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