The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Lower energy consumption, higher conversion efficiency, and longer life lead to a widely use of light emitting diode (LED) in illumination applications. However, the long product life makes it difficult to do reliability test due to the long time it cost. Generally, the reliability performance of the LED is evaluated by thermal cycling and thermal shock. In this paper, a new reliability testing method...
In this work, an n-layer screen printed ceramic on stainless steel based pressure sensor has been designed, fabricated, and characterized as the foundation for high pressure and harsh environment applications. A few layers of dielectric ceramic films were deposited on a thin and flexible stainless steel diaphragm by screen printing and firing. Finite element analysis (FEA) method has been used to...
The investigation aimed to integrate a temperature sensor based on fiber optic Bragg gratings (FBGs) to measure the phosphor/silicone mixture temperature in multichip-on board (MCOB) packaged light-emitting diodes (LEDs). The operating temperature of phosphor/silicone layer was typically measured by the basic Bragg grating-based sensing system. The junction temperature of multichip arrays was derived...
Light-emitting diode (LED) lamps, regarded as ‘green lighting’ fourth-generation light sources, are applied widely to many applications around us. Meanwhile, the chip-on Board (COB) packaging is a fatal important kind of packaging method for LED, with many advantages, such as bigger optical power, more compact size, loss manufacturing cost, and good reliability. However, low light extraction efficiency...
Solder is widely used in electronic packaging to connect die and substrate in die attach process. It is important to get a uniform solder distribution to provide good electrical conductivity, mechanical support as well as excellent thermal properties for packages, especially for power packages with high current densities. While nonuniform solder distribution would emerge when die moves and tilts in...
Ultrasonic heavy aluminum wire bonding whose wire diameter is greater than 100 microns has been the dominant interconnection technology in IGBT modules to implement the electrical connection among chips, DBC substrates and electrode terminals. During the switching on/off operation, the stress concentrates in the bond wire induced by the coefficient of expansion (CTE) mismatch between Al wire and silicon...
An optimal structural design of direct bonding copper (DBC) substrate with ladder shaped copper layers was proposed through numerical optimization approach in this paper. In order to study the fatigue mechanism and life, thermal–mechanical stress and strain distributions of DBC substrates under thermal cycling ranged from −55°C to 150°C were simulated and analyzed by finite element (FE) method. Improved...
With fast growing application of solar photovoltaic (PV) technology, its reliability is being studied extensively. Note that the photovoltaic inverter is considered as the weakest link of a PV system. This paper, therefore, gives a review on reliability of the grid-connected photovoltaic inverter. The discussion mainly focus on two typical kinds of vulnerable inverter components, i.e., DC-capacitors...
Due to the mismatch of coefficient of thermal expansion (CTE) among different structure material, warpage and stress would be generated in the module and then influence the reliability and long term usage. This paper investigate a novel power electronic packaging design using integrated base plate (IBP). Module structure and assembly process of IBP-module have been introduced. The thermal and mechanical...
During the process of power electronic packaging, the warpage of substrate is one of the key parameters in affecting the quality and reliability of microelectronics products. In order to develop the reliability of microelectronics products and reduce the costs, the measurement of the warpage of microelectronics components is essential. In this paper, an array of DBC substrate which two edges were...
Polymer based organic photovoltaic systems, which can be mass-produced by roll-to-roll printing technology, hold the promise for a cost-effective, lightweight and mechanical flexible solar energy conversion platform. Nevertheless, challenges still remain for large-scale applications of these flexible solar cells. One of the issues of great importance is the long-time reliability of solar cell module...
The reliability of electric connection and a stable contact resistance value is usually the most important thing for electrical connector, especially for the electrical connector used in severe environment such as frequently vibration. The present study has investigated the relationship between shrink range and contact resistance of a kind of electrical connector by using the ANSYS software. A indirect...
The paper investigates the insertion force and contact reliability of N electric connector. A finite element model (FEM) of the contacts was created and simulation of the contact force was completed by ANSYS. Impact of the friction coefficient, shrink range, length of socket, and groove width on the insertion force was analyzed by changing the structural parameters. Variation curves of the insertion...
During the process of power electronic packaging, the warpage of substrate is one of the key parameters in affecting the quality and reliability of microelectronics products. In order to develop the reliability of microelectronics products and reduce the costs, the measurement of the warpage of microelectronics components is essential. In this paper, an array of DBC substrate which two edges were...
Polymer based organic photovoltaic systems, which can be mass-produced by roll-to-roll printing technology, hold the promise for a cost-effective, lightweight and mechanical flexible solar energy conversion platform. Nevertheless, challenges still remain for large-scale applications of these flexible solar cells. One of the issues of great importance is the long-time reliability of solar cell module...
The reliability of electric connection and a stable contact resistance value is usually the most important thing for electrical connector, especially for the electrical connector used in severe environment such as frequently vibration. The present study has investigated the relationship between shrink range and contact resistance of a kind of electrical connector by using the ANSYS software. A indirect...
This paper presents a novel Matching Propagation Framework for addressing the problem of finding better matching pairs between each two images, which is one of the most fundamental tasks in computer vision and pattern recognition. We first select initial seed points by original matching method like SIFT, and then use T-CM to explore more seed points. Finally, a triangle constraint based quasi-dense...
With the current trend of cheaper, faster, and better electronic equipment, it has become increasingly important to evaluate the package and system performance very early in the design cycle using simulation tools [1]. Many studies have shown that the profile of temperature has a great impact on solder joint reliability. Undergoing the different temperature profile will get a different solder joint...
Flip-chip packaging on organic substrate has been used widely as a promising package technology for the next generation of electronic devices. However, due to its numerous interfaces (i.e. die/passivation, passivation/underfill, underfill/solder mask, and solder mask/circuit board), it is more susceptible to a variety of complexworking and testing environments, delamination can easily take place in...
With the development of the equipment, general quality characteristics (GQCs) are getting more and more important. This paper mainly focuses on the procedure and several methods for identification of GQCs.
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.