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As 2.5D/3D die stacking technology emerges, stacked dynamic random access memory (DRAM) has been proposed as a cache due to its large capacity in order to bridge the latency gap between off-chip memory and SRAM caches. The main problems in utilizing a DRAM cache are the high tag storage overhead and the high lookup latency. To address these, we propose tags-in-eDRAM (embedded DRAM) due to its higher...
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