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In this paper, an integrated testing, finite element modeling and failure analysis approach for drop test reliability of wafer level packages is developed to examine the shock performance of large array wafer level packages. For standard JEDEC drop test, it has been found that corner component group (group A) failed first for 12 times 12 array packages. This is different from previously reported failure...
In this paper, thermo-mechanical reliability of a variety of state-of-art wafer level packaging (WLP) technologies is studied from a structural design point of view. Various WLP technologies, such as Ball on I/O with and without redistribution layer (RDL), Ball on Polymer with and without under bump metallurgy (UBM) process, and encapsulated Copper Post WLPs, are investigated for their structural...
Wafer Level Packaging (WLP) has the highest potential for future single chip packages because the WLP is intrinsically a chip size package. The package is completed directly on the wafer then singulated by dicing for the assembly. All packaging and testing operations of the dice are replaced by whole wafer fabrication and wafer level testing. Therefore, it becomes more cost-effective with decreasing...
Wafer-level packaging (WLP) is essentially a true chip-scale packaging (CSP) technology, since the resulting package is practically of the same size as the die. Furthermore, wafer-level packaging paves the way for true integration of wafer fab, packaging, test, and burn-in at wafer level, for the ultimate streamlining of the manufacturing process undergone by a device from silicon start to customer...
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