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Three-dimensional integration of microelectromechanical systems (MEMS) and CMOS is able to achieve hetero-integrated microsystems with high performance, small size, low cost, and multiple functions. This paper reports a 3-D integration method using wafer transfer technology and electroless Ni plating with a noncontact induction (ENPNI) technique. Wafer transfer technology based on adhesive bonding...
We present a generic three-dimensional (3-D) integration method to fabricate suspended single crystalline silicon (SCS) MEMS arrays on CMOS. The method is based on transferring the SCS device layer of SOI on the top of CMOS. For general purpose, thin MEMS arrays with long supporting arms are demonstrated. The fabrication process is clarified in details. Mechanical reliability of the suspended structure...
This paper describes a high-voltage-enabling circuit technique for enhancing the gain precision and linearity of OpAmp-based analog circuits. Without resorting from specialized devices, a 2xVDD-enabled recycling folded cascode (RFC) OpAmp optimized in 1V GP 65-nm CMOS achieves, when compared with its 1xVDD counterpart, 25-dB higher open-loop DC gain and 30-dB higher IM3 (in closed loop), under a similar...
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