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This paper presents the studies on the influences of thermally induced package effects on radio frequency (RF) characteristics of surface acoustic wave (SAW) devices. A packaged SAW resonator is modeled based on finite element method (FEM), and surface deformation of the chip substrate during packaging process is analyzed. RF characteristics of the device are simulated and compared before and after...
This paper presents studies on the influences of alumina film overly coated on the chip surface on the RF characteristics of surface acoustic wave (SAW) devices during packaging process. An SAW resonator is taken as an example and the surface layer deformation of the chip substrate with different thicknesses of alumina overlay is simulated based on finite element method (FEM). The RF characteristics...
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