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Systematic cutting process design and optimization problems are studied for surface roughness minimization by stochastic algorithms. As the experimental background of the study, n-type single crystalline silicon (Si) ingot are cut into Si wafer with a thickness of 375 µm using a wire saw machine. In order to optimize the cutting parameters successfully, a two-step study has been organized as (i) a...
An Artificial Neural Network (ANN) simulation was utilized to predict surface roughness values (Ra) for a Silicon (Si) ingot cutting operation with a Diamond Wire Saw (DWS) cutting machine. Experiments were done on a DWS cutting machine to obtain data for training, testing and validation of the ANN. The DWS cutting operation had three parameters affecting surface quality: spool speed, z axis speed...
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