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Interconnect is one of the most important functions of packaging technology. It delivers power and signals into and out of electronic systems. The performance and reliability of microsystems are dependent on the interconnect quality. This paper reviews the chip-level interconnects based on carbon nanotubes (CNTs), this includes their applications for both on-chip and off-chip interconnects. Various...
The need for faster, smaller, more reliable and efficient products has resulted in increased heat generated in microelectronic components. Removal of the heat generated is an important issue in electronic packaging. Therefore, a novel Nano-Thermal Interface Material was developed to improve this. This paper aims at studying the thermal performance of the new nano-structured polymer-metal composite...
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