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Solder is widely used in electronic packaging to connect die and substrate in die attach process. It is important to get a uniform solder distribution to provide good electrical conductivity, mechanical support as well as excellent thermal properties for packages, especially for power packages with high current densities. While nonuniform solder distribution would emerge when die moves and tilts in...
With the trend to be smaller, more integration and higher power in power electronic technology, the cooling problem has become increasingly prominent for those high power devices. Micro-channel in substrate, as an effective cooling method, has been proposed and investigated by many researchers in recent years. Warpage and stress, naturally existing in all the packaging processes due to the unavoidable...
With the trend to be smaller, more integration and higher power in power electronic technology, the cooling problem has become increasingly prominent for those high power devices. Micro-channel in substrate, as an effective cooling method, has been proposed and investigated by many researchers in recent years. Warpage and stress, naturally existing in all the packaging processes due to the unavoidable...
Die attach process is widely used to realize the connection between die, device and the rest of the system in electronic packaging. During this process, the die moves under the capillary force induced by the liquidus solder. Such a die tilt phenomenon usually occurs and strongly worsens the reliability and performances of devices. In this paper, we built a numerical model based on fluid minimal free...
In this paper, the failure mechanisms of the direct bonding copper (DBC) substrate under the condition of temperature cycling are studied. The cyclic temperature considered ranges from −40°C to 200°C. Furthermore, finite element method is used to optimize the DBC substrate structure in order to reduce the thermal stress and improve the reliability and fatigue life of power modules. Various factors...
The problem of heat dissipation of high power electronics such as IGBT (Insulated Gate Bipolar Transistors) has puzzled us for long time. If the heat generated from the chips could not be eliminated away from the devices, the failure rate would rise rapidly. To deal with this problem, the micro pumps along with the microchannel embedded in the DBC substrate are proposed to remove the heat actively...
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