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Thin nanocrystalline, compact films, based on the copper–nitrogen system, up to 2.5μm thickness and 3.5% nitrogen, were deposited by magnetron sputtering at different partial pressure ratios of N 2 and Ar, without formation of Cu x N compounds, the nitrogen concentration influencing grain size (down to 30nm) and film homogeneity. Electrochemical corrosion properties were investigated...
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