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This paper presents some experimental observations relative to the influence of elevated current densities on the intermetallic growth and phase evolution in Cu/Sn–58Bi/Cu solder joints. Three samples were stressed with different current densities of 104, 1.2 × 104, and 1.4 × 104 A/cm2, respectively, for 80 h. The abnormal polarity effect of electromigration (EM) on chemical reactions at the cathode...
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