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Background Hospital nurses are exposed to various work-related factors that may be associated with increased risk of developing different mental disorders. Empirical evidence on the prevalence and correlates of individual mental health problems such as stress, anxiety and depression is widely reported, while a combined pattern of these conditions is unknown. This study aims to examine the co-occurrence...
Through Silicon Vias (TSV) is a key enabler for interposer and 3Di technologies. As the TSV process integration is maturing, reliability is a key parameter to be studied. One such reliability wear-out mechanisms is electro-migration (EM). In this paper, we report on experimental electromigration studies of TSVs used in 3-Dimensional integration (3Di). While TSV themselves can carry large currents,...
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