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A new lead-free Sn-1.0Ag-0.7Cu-xSnO2 composite solder was smelted in a vacuum arc furnace at 900°C for 30 min. This paper investigated the influence of SnO2 nanoparticles on the microstructure, melting properties and growth of interfacial intermetallic compounds (IMCs) at the interface between Cu and the composite solder during isothermal aging. The results indicated that SnO2 particles effectively...
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