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Intermetallic compounds (IMCs) that form at eutectic Sn3.5Ag/Cu and pure Sn/Cu interfaces during solid-state aging are comparatively studied in terms of their respective morphological formations. During solid-state aging, all the interfacial Cu6Sn5 grains evolve into a layer-type morphology, except for select grains that experience abnormal growth. This abnormal growth is caused by the preferential...
Intermetallic compounds (IMCs) that form at eutectic Sn3.5Ag/Cu and pure Sn/Cu interfaces during solid-state aging are comparatively studied in terms of their respective morphological formations. During solid-state aging, all the interfacial Cu6Sn5 grains evolve into a layer-type morphology, except for select grains that experience abnormal growth. This abnormal growth is caused by the preferential...
Epitaxial growth of intermetallic compounds formed at eutectic Sn37Pb/ polycrystalline Cu interface during solid-state aging. The results show that the interfacial Cu6Sn5 grains exhibit textured growth under solid-state condition and their preferred orientations are affected by the as-soldered joints. Cu6Sn5 grains with [0001] direction normal to the interface are stable in solid and molten Sn37Pb...
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