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The voiding phenomenon at the interface has been proven to weaken the mechanical properties of solder joints. The aim of this study was to investigate the influence of grain size on voiding propensity. Two kinds of substrates were used: high purity oxygen free copper (HPOFC) substrate and electrolytic tough pitch copper (ETPC) substrate. Grain size and voiding propensity were characterized by introducing...
The interfacial reaction and the growth kinetics of intermetallic compounds between 63Sn37Pb (wt.%) solder and the electroplated silver layer during the solid-state aging were studied in this paper. To measure the growth kinetics of Ag3Sn, the product of the interfacial reaction, more accurately, we used the quasi in situ method. And three same joints between solar cells and solder were annealed at...
The shearing strength and the void ratio of serial solder joints are discussed in this paper. Pb-containing solders, Sn-90Pb, Sn-95Pb, Sn-37Pb and Sn-3.0Ag-0.5Cu Pb-free are soldered with MoCu substrate using vacuum soldering. Results show that, Sn-90Pb, Sn-95Pb solder joints have many voids in the joint interface, and resulting low shearing strength. Sn-37Pb and Sn-3.0Ag-0.5Cu solder joints have...
The shearing strength and the void ratio of serial solder joints are discussed in this paper. Pb-containing solders, Sn-90Pb, Sn-95Pb, Sn-37Pb and Sn-3.0Ag-0.5Cu Pb-free are soldered with MoCu substrate using vacuum soldering. Results show that, Sn-90Pb, Sn-95Pb solder joints have many voids in the joint interface, and resulting low shearing strength. Sn-37Pb and Sn-3.0Ag-0.5Cu solder joints have...
The solder joints of SAC305/Cu were aged at ultra-high temperature of 210°C, near the melting point of the solder. The growth kinetics of interfacial IMCs follows the diffusion-controlled kinetics. But there are some Cu6Sn5 particles in the solder bulk. With the aging time increasing, the particles can coalesce into long needle-type Cu6Sn5. This is a unique phenomenon different from traditional thermal...
As the solder joints become increasingly small and contain only a few grains, their mechanical properties cannot be determined from conventional mechanical tests as with bulk samples, and there may be a considerable variation in mechanical behavior from joint to joint because of the anisotropy of mechanical properties. In this paper, elastic constants of single-crystal AuSn4 and AuSn2 were preliminarily...
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