The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The voiding phenomenon at the interface has been proven to weaken the mechanical properties of solder joints. The aim of this study was to investigate the influence of grain size on voiding propensity. Two kinds of substrates were used: high purity oxygen free copper (HPOFC) substrate and electrolytic tough pitch copper (ETPC) substrate. Grain size and voiding propensity were characterized by introducing...
Electrodeposited (ED) Cu was prepared and exhibited a strong voiding propensity at the Cu3Sn/Cu interface in the subsequent Sn3.0Ag0.5Cu/Cu solder joint. However, we found that the rapid thermal processing treatment could significantly reduce the voiding propensity of ED Cu. After rapid annealing, the grain size of Cu was obviously increased, which was found to reduce the amount of effective vacancies...
Effect of Cu grain size on void formation at the interface of SAC305 (Sn3.0Ag0.5Cu)/Cu solder joint was studied. The joints with ED CCL (Electrodeposited Copper Clad Laminate) substrates exhibited a strong voiding tendency. But this tendency was significantly reduced after annealing treatment at 150°C for 1000h. At the same time, no voids were found at the interface of SAC305/HPOFC (High Purity Oxygen...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.