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High-temperature-stable Cu3Sn-based joints were selectively fabricated using electric current-assisted bonding process within an extremely short time (∼200 ms) and under a low pressure of 0.08 MPa in a Cu/Sn/Cu interconnection system at ambient temperature. The experimental results showed that the imposed electric current density (∼104 A/cm2) resulted in sharply increased local temperature as well...
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