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In the paper, a three-dimensional finite element model was developed to demonstrate the temperature field induced by a nanosecond pulsed excimer laser in the phase-change film. The numerical model was established with an assumed rectangular temporal profile, following the continuous medium heat conduction theory with semi-infinity heat conduction. It showed that the temperature variation followed...
Tungsten (W)-plug via failure in multi-level interconnects is one of the key reliability issues, due to electromigration and stress migration concerns. Electromigration (EM) failure of the interconnects is usually accelerated after thermal anneals due to stress voiding. In this study, we show that the electromigration lifetime of the via can significantly be improved after thermal anneal by the careful...
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