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This paper presents a co-process technology of the through silicon via (TSV) and embedded IC for 3D heterogeneous IC integration. Heterogeneous ICs are embedded by using silicon cavities and advanced TSVs for 3D interconnection are integrated in the interposer at the same time. Organic lamination is used to fill the gap and make an insulation layer. A laser drilling process is used to make via interconnections...
In almost all industrial site, various laser systems have been widely applied because of their characteristics such as high energy density, directivity and coherence. Nowadays the clinical application has become wider in medical parts such as incurable disease, diagnosis etc. Ruby laser has the greatest efficacy for removing tattoos, freckle and other skin problem. But commercial medical ruby laser...
An interlaced dual-energy electron LINAC was developed for cargo inspection systems. The electron energy is varied based on the RF power level and initial current of the E-gun. This paper describes a dual-energy driving method for an interlaced dual-energy electron LINAC using variable applied levels of the E-gun dual-pulse power supply, a high voltage modulator, and a dual RF power source. The electron...
The Beam dynamics of S-band 10 MeV electron LINAC for Container Inspection System (CIS) was carried out with beam dynamics code E-GUN[1] and PARMELA[2]. This S-band LINAC is consists of DC-gun injector, side-coupled accelerating structure, waveguide power coupler, klystron with modulator, vacuum device, water cooling and control system.
In recent year, the computer codes for solving 3-D full-wave electromagnetic field, for example CST (microwave studio) or HFSS (high frequency structure simulation), just have enough accurate to used for the multi-cavities accelerating structure design, such as dispersion relation, cavity geometry, et.al‥ Before that, the geometry design was just based on analytical expression, experimental trial...
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