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Capillary Underfill Materials
Underfill materials with high thermal conductivity play crucial roles in ensuring the reliability and performance of microelectronic devices with ever‐increasing power density. In article number 2201023, Xiaolin Xie, Yiu‐Wing Mai, and co‐workers review the state‐of‐the‐art advances on capillary underfill materials and give future perspectives for designing high‐performance...
The integrated circuits industry has been continuously producing microelectronic components with ever higher integration level, packaging density, and power density, which demand more stringent requirements for heat dissipation. Electronic packaging materials are used to pack these microelectronic components together, help to dissipate heat, redistribute stresses, and protect the whole system from...
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