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Radar sensors are already employed in production model vehicles e.g. for adaptive cruise control (ACC) systems. Further development of driver assistance systems has also led to the use of radar sensors in active safety systems (active brake assistance, collision warning, emergency braking, etc). However, the costs of manufacturing such radar-based systems, capable of gathering reliable information...
This paper addresses the reliability of flip-chip on flex (FCOF) assemblies glued with an Ag-particle filled anisotropic conductive adhesive (ACA). As the description of FCOF failure gives still much scope for speculation, a physics of failure based approach is developed here, taking into account the changing thermo-mechanical properties of the ACA under temperature and moisture. A failure hypothesis...
The use of multi-layer ceramic chip capacitors as integrated passive in e. g. system in package applications needs methods to examine and predict their reliability. Therefore, a nondestructive failure analytical technique is described to detect cracks in the ceramic and the metallic layers within encapsulated 0402 SMD capacitors. After choosing from techniques to reproducibly generate cracks, it is...
A new packaging technology for a micro-electro-mechanical system (MEMS) pressure sensor was developed to allow the integration of the sensor in a probe mounted on the outside of the airplane. Thus this packaging concept will increase the reliability of equipment by avoiding extra pneumatic connections. Intrinsic advantages of this approach are the avoidance of pressure leaks and the elimination of...
In the field of microelectronics encapsulation transfer molding is the process of choice for high volume and high reliability encapsulation of microelectronics devices. The materials used for transfer molding are highly filled epoxy based systems, with typically good CTE matching to encapsulated components and high media and temperature resistance. Especially harsh environment applications as automotive,...
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