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Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Mold embedding for this technology is currently done on wafer level up to 12”/300 mm size. For higher productivity and therewith lower costs larger mold embedding form factors are forecasted for the near future. Following the wafer level approach then the next step will be a reconfigured wafer size of...
The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing and 3D integration with potential for low cost applications. Large area mold embedding technologies and embedding of active components into printed circuit boards (Chip-inPolymer) are two major packaging trends in this area. Mold embedding...
The constant drive to further miniaturization and heterogeneous system integration leads to a need for new packaging technologies which also allow large area processing with potential for low cost applications. Wafer level embedding technologies and embedding of active components into printed circuit boards (Chip-in-Polymer) are two major packaging trends in this area. This paper describes the use...
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