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A simple mass producible uncooled thermoelectric infrared microsensor has been designed and fabricated. To improve the cost-efficiency, an advanced micromachining process, which combines wet anisotropic pre-etching and dry isotropic post-etching, is adopted for the sensor fabrication. The wet anisotropic pre-etching removes bulk silicon from back-side and forms a thin silicon membrane...
The interface of Au/Si(100) eutectic bonding was studied by infrared microscope. During Au/Si(100) bonding, the dissolution of the Si(100) surface primarily occurs by the formation of the craters which result in many square black spots in the IR images. The formation of the craters is ascribed to the anisotropic nature of Au/Si reaction that results in three-dimensional dissolution behavior on the...
This paper presents a hybrid silicon etching processing technique for removing the entire bulk silicon to release microstructure. The proposed method that combines a back-side wet anisotropic pre-etching and a front-side XeF2 dry isotropic post-etching differs from previous works in silicon micromachining. Wet anisotropic pre-etching enhances the low-cost of the proposed method while the XeF2 dry...
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