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Cu-to-Cu and Si-to-direct bonded copper (DBC) assemblies were bonded with SAC305 solder (reference) as well as with composite layers consisting of SAC305 solder matrices with integrated thin Cu and Ni meshes. The microstructural changes at the interfaces, such as the growth of intermetallic compound (IMC) layers and void formation, were monitored during annealing of the Cu-to-Cu samples at constant...
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