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3-D many-core processor (3-D MCP) has become an emerging technology to tackle the power wall problem due to rapidly increasing number of transistors. However, when maximizing the throughput of 3-D MCP, which is expressed as a weighted sum of the speeds, due to the inherent heat removal limitation, thermal issues must be taken into consideration. Since the temperature of a core strongly depends on...
This paper presents a state-of-art advance in 3D integrations. It illustrates the need for a high-performance 3D design driven by dynamic power and thermal integrity. The through-silicon-via (TSV) is used to simultaneously deliver power supply and remove heat. More importantly, to cope with the large-scale design complexity, the modern macromodeling technique is applied to handle not only large numbers...
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