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The abrasive is one of the important influencing factors during the chemical mechanical polishing (CMP) process. Although α-alumina is one of the most commonly used sapphire polishing abrasives due to its high hardness, it often results in surface damage. To receive lower surface roughness and high material removal rate, a common approach is to modify the surface of alumina. In this work, a series...
Chemical mechanical polishing (CMP) has become a widely accepted global planarization technology. Abrasive is one of the key elements in CMP process. In order to enhance removal rate and improve surface quality of sapphire substrate, a series of novel La-doped colloidal SiO2 composite abrasives were prepared by seed-induced growth method. The CMP performance of the La-doped colloidal SiO2 composite...
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