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This paper reports InAs quantum-well (QW) MOSFETs with record transconductance (gm,max = 1.73 mS/µm) and high-frequency performance (fT = 245 GHz and fmax = 355 GHz) at Lg = 100 nm. This record performance is achieved by using a low Dit composite Al2O3/InP gate stack, optimized layer design and a high mobility InAs channel. This work is significant because it shows a possible III-V material pathway...
In this work we have investigated the effect of thin In0.2Ga0.8As capping layer and pulsed laser annealing (PLA) on self-aligned enhancement mode n-channel In0.53Ga0.47As metal-oxide-semiconductor field effect transistor (MOSFET). We present the electrical and material characteristics of TaN/ZrO2/In0.2Ga0.8As/In0.53Ga0.47As n-MOSFET with atomic layer deposition (ALD) ZrO2. Electrical characteristics...
High mobility, narrow band gap group IV and III-V materials are strong contenders to replace strained-Si channels for logic applications beyond the 16 nm node [1-3]. While there are many research efforts evaluating III-V channels in HEMT and MOSFET forms, model based understanding and control of the FET properties such as channel mobility, series resistance, and off-state leakage are still lacking...
We report the fabrication of high-electron-mobility Ge(III) n-MOSFETs using a novel and simple approach to passivate a Ge surface by rapid thermal oxidation (RTO). A thin interfacial GeO2 layer is formed by RTO, which passivates the high-k/Ge interface. The GeO2-passivated n-MOSFETs fabricated using a gate-first self-aligned process with high-k/metal gate demonstrate a high peak effective mobility...
We have studied key parameters for controlling threshold voltage (Vth) variation and strain maintenance of gate first SiGe channel pMOSFETs. By overcoming 1) Ge diffusion and 2) strain relaxation during source/drain activation, we for the first time demonstrate high Ge% (50%) SiGe channel with millisecond flash anneal. Optimizing the thermal budget with millisecond anneal keeps the Vth variation same...
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