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In this paper, we report a concept of integrating a monolithic buck converter power IC with in-package bondwire inductors. The power IC was designed and fabricated with a standard 0.5μm CMOS process. Multi-turn bondwires with and without ferrite epoxy glob cores are used as the filter inductor in the buck converter. A 2.5V/120mA prototype system in package (SiP) buck converter is built to operate...
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