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POP (package-on-package) integration is achieved by stacking laminate substrate packages in vertical direction and interconnecting them with solder balls. Some mechanical reliability issues were addressed through POP development. In particular, package warpage and Si delamination were dominate issue. Package warpage was characterized with FEM-modeling, Shadow Moire and viscoelastic property measurement...
We have measured optical second harmonic intensity from arrays of Pt nanowires of 20nm and 9nm average widths, as a function of the incident and output light polarizations, the azimuthal angle, and the excitation photon energy. The nanowires were fabricated through shadow deposition on self-organized NaCl(110) faceted templates. The anisotropy of the SH intensity from the Pt nanowires was found to...
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