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For 3D IC application, The thickness of micro joint is basically smaller than that in the conventional joint. IMCs can easily occupy micro joints during assembling or operation and then dominate the properties of micro joint. It is predicted that IMCs are going to be utilized as structural materials in near submicron-scale micro joint in these few years. The micromechanical behavior of IMCs is the...
For 3D IC application, solder volume in micro joint is much smaller than in the conventional joint. IMCs can easily occupied micro joints and dominate the properties of micro joint. Thus, it is anticipated that IMCs are to be used as structural materials in commercial scale in a few years. However, mechanical property data for reliability modelling are lacking. To characterize mechanical properties...
Previous studies have shown that voids were observed in 3D IC-scaled micro joints of Ni/Sn/Ni solid state reaction under severe space confinement and Ag addition can effectively eliminate the void formation. Therefore, the present study is aimed at investigation of the lower limit of Ag concentration which prevents void formation and also the effect of Ag concentration when primary Ag3Sn appears....
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