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This paper presents results of signal integrity study conducted on two packaging designs: redistribution layer (RDL) for face-to-face stacking and 2.5D interposer for lateral connection of four processor chips with high performance memory die having a bandwidth of 4Tb/s.
A multi-capacitor coupled signaling structure is employed to enable low-power high frequency communications in 10 mm long interposer traces. On-chip Metal-Insulator-Metal (MIM) capacitor was used to implement the Multi capacitor structure. A continuous time feed forward tunable capacitive equalization was used to compensate for the frequency dependent losses. The multi-capacitor structure is used...
A probe design for detecting discontinuities of a redistribution layer (RDL) on TSV silicon interposer is presented in this paper. The probe is a 60 GHz contactless system based on a quarter-wavelength directional coupler, using the capacitive coupling effects between two signal traces. The probes consists of one ground plane and one signal trace embedded in BCB, low dielectric constant insulator...
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