The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
System architects traditionally use high-level models of component blocks to predict trends for various design metrics. However, with continually increasing design complexity and a confusing array of manufacturing choices, system-level design decisions cannot be made without considering physical-level details. This effect is more pronounced for 3-D integrated circuits (ICs) because it provides a plethora...
Three dimensional integration technology has the potential to provide enhanced performance and device density gains beyond that available from technology scaling alone. However, it provides plethora of design choices for system designers. The full exploitation of the benefits of 3D integration requires a system-level exploration flow which can facilitate in finding an optimal 3D design by comparing...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.