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We studied the impedance characteristics of through-silicon via (TSV)-based power delivery networks (PDNs) for hierarchical on-die simulation and interconnect noise analysis. This paper compares the quality of power delivery in 3-D stacking scenarios for three distinct chip stacking topologies: 1) face-to-back (F2B); 2) face-to-face (F2F); and 3) back-to-back (B2B). Quantitatively, this paper compared...
In this paper, we model and analyse a hierarchical TSV-based chip-package co-design of the power delivery network (PDN) for three-dimensional integrated circuits (3DICs). It is a significant design consideration to combine chip/package PDN structures, accurately characterize and quantify their overall impedance, 1st-droop effect and resonant noise behaviour for multi-stacked chips. To better understand...
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