Search results for: Paul D. Franzon
Journal of Electronic Materials > 2018 > 47 > 2 > 994-997
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 8 > 1251 - 1260
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2016 > 24 > 3 > 1151 - 1164
Integrated Circuits and Systems > 3D Integration for NoC-based SoC Architectures > Technology and Circuit Design > 75-88
2015 International 3D Systems Integration Conference (3DIC) > TS6.1.1 - TS6.1.2
2015 International 3D Systems Integration Conference (3DIC) > TS10.2.1 - TS10.2.4
2015 International 3D Systems Integration Conference (3DIC) > TS8.27.1 - TS8.27.4
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2015 > 5 > 4 > 541 - 550
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2014 > 4 > 11 > 1862 - 1870