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Hundreds of features extracted from object images need to be detected and every feature need to be evaluated by its threshold in AOI system. In order to cope with the study problem of multi-parameters thresholds during the solder joint surface qualify inspection in AOI system, a self-adaptive study method is proposed in this manuscript. Firstly, solder joint features are extracted from the solder...
A cause analysis model of pseudo solder for chip component is presented. Based on analyzing the causes of the chip pseudo solder, an comprehensive equation, which is composed of an ellipse equation and a circle equation, is used to fit the surface shape of chip solder joint. On the basis of that, the chip pseudo solder model is presented. All the parameters of the chip pseudo solder model are effected...
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