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In this paper, a bipolar resistive random access memory (RRAM) device with a fab-friendly materials stack (TiN/Ti/HfO2/TiN) and process in a via-hole substrate with 200 nm cell size was successfully demonstrated on an 8-inch wafer scale. Furthermore, the robust device characteristics with reliable switching uniformity and stability were experimentally confirmed at the wafer level. Finally, from the...
Current overshoot has severe effects on the reliability of resistive random access memory (RRAM). It is well known that the current overshoot during the SET process is caused by parasitic capacitance. In this letter, we observed a different type of current overshoot during the RESET process. The RESET current overshoot was confirmed to have severe effects on the endurance of RRAM. We also demonstrated...
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