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This paper reviews the research work and achievements on microelectronic interconnect and packaging materials, and the advanced manufacturing technologies in general research institute for non-ferrous metals. Several kinds of novel lead-free alloys, such as Sn-Ag-Cu-Cr, Sn-Zn-X, Sn-Bi-Cu have been studied. The effect of micro alloying on the tin-based solder has been investigated. Ultrasonic atomization...
The triple axis mode X-ray diffraction method is described, which has been used to measure the spatial variation in the lattice parameters of {100} lightly Cr-doped SI-GaAs laser windows. It has been found that a remarkable spatial variation of elastic strain exists in the window wafer. The results show that the thinner the wafer is, the smaller the stress spatial variation in the wafer. The elastic...
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