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For the production of thermoelectric modules, Bi0.5Sb1.5Te3 was sequentially electroplated with a 4-μm Ni barrier layer and a 10-μm Ag layer and then diffusion soldered with the Cu electrode, which was also electroplated with 4-μm Ag and 4-μm Sn layers. The Bi0.5Sb1.5Te3 and Ni interface with no sufficient chemical bonds resulted in a bonding strength lower than 3 MPa. Through the pre-coating of a...
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