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Machining technology about silicate glass has been developed very fast over recent years due to the growing industrial demand of higher machining accuracy and better surface quality of optical elements while the nature of hard and brittle materials makes it difficult to acquire damage-free and ultrasmooth surface. Molecular dynamics method (MD) provides a promising approach for constructing an efficient...
The surface planarization in the chemical mechanical planarization is mainly realized by the mechanical effect which depends on the micro-tribology behavior of nanoparticles. The material removal rate is decreased and micro-scratch is generated in the wafer surface due to the agglomeration of particles. The slurry particles hold definite energy level and microstructure which makes the classical materials...
With the development of semiconductor industry, the polishing method has already became the main stream technique in realizing the global flatness. Because of lacking investigation physical essence of polishing, the prediction power and robustness of today's material removal model is poor. In order to understanding micro-mechanism underlying planarization, the author carried out computer simulation...
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