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Far Target Location (FTL) is a key element of the US Army's Force Operating Capabilities (FOC) doctrine to see, understand, and act first and foremost on the battlefield. Precise FTL data provides today's Soldier with essential information pertaining to direct and indirect fire, surveillance, and maneuver missions, where reliable and accurate Situational Awareness (SA) is vitally important for dismounted...
This paper presents both the effect of cutting on the material behavior of a typical used NGO electrical steel grade M230-30A as well as a study of the effect of annealing temperature after cold rolling on microstructure and magnetic properties beginning with an industrial hot rolled 2.4 wt.% Silicon steel of 2.0mm thickness. Modifications in the local mechanical properties due to the cutting process...
The buildings of Bikaner are reasonably comfortable indoors because of thermal damping by the massive roofs and walls. However, the average indoor air temperature (over 24 hours) is about the same as the average outdoor air temperature. In a light-weight building without any external glazing and without any ventilation, the average indoor air temperature is the same as the area weighted average of...
TDDB (time-dependent-dielectric-breakdown) method used to predict the gate oxide lifetime is based on DC stress. But the product-level burn-in tests are done with AC stress pulses applied to the chip. DC lifetime does not predict the effect of burn-in on oxide reliability. In this paper pre-conditioning pulses are used to simulate burn-in effects. It was observed that the pre-conditioning causes decrease...
Negative Bias Temperature Instability (NBTI) is one of the key reliability issues for deep sub-micron semiconductor technologies. In this paper, geometry dependence on the NBTI performance of the PMOS FET is studied by conducting measurements on different FET geometries from a 65 nm CMOS technology. A channel length dependent NBTI model is derived based on this characterized data at different stress...
New approaches to thermal management of electronic components are of general interest. Our work demonstrates a novel solution for this applications area. Highly effective thermal management solutions can potentially help the semiconductor manufacturers to reduce costs and meet some milestones of the silicon roadmap. For example, enormous amount of Joule heating and inability of the state-of-the art...
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