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The breakdown of Dennard scaling prevents us from powering all transistors simultaneously, leaving a large fraction of dark silicon. This crisis has led to innovative work on power-efficient core and memory architecture designs. However, the research for addressing dark silicon challenges with network-on-chip (NoC), which is a major contributor to the total chip power consumption, is largely unexplored...
As the number of processing elements increases in a single chip, the interconnect backbone becomes more and more stressed when serving frequent memory and cache accesses. Network-on-Chip (NoC) has emerged as a potential solution to provide a flexible and scalable interconnect in a planar platform. In the mean time, three-dimensional (3D) integration technology pushes circuit design beyond Moore's...
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